Solder paste column M705, flux, board washing drinking water with complete alcohol; board washing h2o is applied to scrub up the solder residue soon after repair; thermal gel (specification: Fujipoly SPG-30B) is accustomed to smear the surface area from the chip soon after repair ；ball-planting metal mesh, solder absorption https://michelangelom494qhx5.mybuzzblog.com/profile